HMK325BJ104KF-T [TAIYO YUDEN]

CAP CER 0.1UF 100V X5R 1210;


型号：	HMK325BJ104KF-T
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	CAP CER 0.1UF 100V X5R 1210
文件：	总22页 (文件大小：552K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

for General Electronic Equipment

Notice for TAIYO YUDEN products

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product Information in this Catalog

(4) Power generation control equipment (nuclear power,

hydroelectric power, thermal power plant control system, etc.)

(5) Undersea equipment (submarine repeating equipment,

underwater work equipment, etc.)

(6) Military equipment

(7) Any other equipment requiring extremely high levels of safety

and/or reliability equal to the equipment listed above

Product information in this catalog is as of OJacntouabreyr22002210.. AAlllloofftthhee

contents speciﬁed herein and production status of the products listed in

this catalog are subject to change without notice due to technical

improvement of our products, etc. Therefore, please check for the latest

information carefully before practical application or use of our products.

Please note that TAIYO YUDEN shall not be in any way responsible

for any damages and defects in products or equipment incorporating

our products, which are caused under the conditions other than those

speciﬁed in this catalog or individual product speciﬁcation sheets.

*Notes:

1. There is a possibility that our products can be used only

for aviation equipment that does not directly affect the safe

operation of aircraft (e.g., in-flight entertainment, cabin

light, electric seat, cooking equipment) if such use meets

requirements speciﬁed separately by TAIYO YUDEN. Please

be sure to contact TAIYO YUDEN for further information

before using our products for such aviation equipment.

2. Implantable medical devices contain not only internal unit

which is implanted in a body, but also external unit which is

connected to the internal unit.

Approval of Product Speciﬁcations

■

Please contact TAIYO YUDEN for further details of product

specifications as the individual product specification sheets are

available. When using our products, please be sure to approve our

product speciﬁcations or make a written agreement on the product

speciﬁcation with TAIYO YUDEN in advance.

Pre-Evaluation in the Actual Equipment and Conditions

Please conduct validation and veriﬁcation of our products in actual

conditions of mounting and operating environment before using our

products.

4. Limitation of Liability

■

Please note that unless you obtain prior written consent of TAIYO

YUDEN, TAIYO YUDEN shall not be in any way responsible for

any damages incurred by you or third parties arising from use of

the products listed in this catalog for any equipment that is not

intended for use by TAIYO YUDEN, or any equipment requiring

inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN

as described above.

Limited Application

1. Equipment Intended for Use

The products listed in this catalog are intended for general-

purpose and standard use in general electronic equipment (e.g.,

AV equipment, OA equipment, home electric appliances, office

equipment, information and communication equipment including,

without limitation, mobile phone, and PC) and other equipment

speciﬁed in this catalog or the individual product speciﬁcation sheets.

Safety Design

■

When using our products for high safety and/or reliability-required

equipment or circuits, please fully perform safety and/or reliability

evaluation. In addition, please install (i) systems equipped with

a protection circuit and a protection device and/or (ii) systems

equipped with a redundant circuit or other system to prevent an

unsafe status in the event of a single fault for a failsafe design to

ensure safety.

TAIYO YUDEN has the line-up of the products intended for

use in automotive electronic equipment, telecommunications

infrastructure and industrial equipment, or medical devices

classified as GHTF Classes A to C (Japan Classes I to III).

Therefore, when using our products for these equipment,

please check available applications specified in this catalog

or the individual product specification sheets and use the

corresponding products.

Intellectual Property Rights

■

Information contained in this catalog is intended to convey examples

of typical performances and/or applications of our products and is

not intended to make any warranty with respect to the intellectual

property rights or any other related rights of TAIYO YUDEN or any

third parties nor grant any license under such rights.

2. Equipment Requiring Inquiry

Please be sure to contact TAIYO YUDEN for further information

before using the products listed in this catalog for the following

equipment (excluding intended equipment as specified in this

catalog or the individual product speciﬁcation sheets) which may

cause loss of human life, bodily injury, serious property damage

and/or serious public impact due to a failure or defect of the

products and/or malfunction attributed thereto.

(1) Transportation equipment (automotive powertrain control

system, train control system, and ship control system, etc.)

(2) Trafﬁc signal equipment

Limited Warranty

Please note that the scope of warranty for our products is limited to

the delivered our products themselves and TAIYO YUDEN shall not

be in any way responsible for any damages resulting from a failure

or defect in our products. Notwithstanding the foregoing, if there is

a written agreement (e.g., supply and purchase agreement, quality

assurance agreement) signed by TAIYO YUDEN and your company,

TAIYO YUDEN will warrant our products in accordance with such

agreement.

(3) Disaster prevention equipment, crime prevention equipment

(4) Medical devices classiﬁed as GHTF Class C (Japan Class III)

(5) Highly public information network equipment, data-

processing equipment (telephone exchange, and base

station, etc.)

TAIYO YUDEN’s Ofﬁcial Sales Channel

■

The contents of this catalog are applicable to our products which are

purchased from our sales ofﬁces or authorized distributors (hereinafter

“TAIYO YUDEN’s ofﬁcial sales channel”). Please note that the contents

of this catalog are not applicable to our products purchased from any

seller other than TAIYO YUDEN’s ofﬁcial sales channel.

(6) Any other equipment requiring high levels of quality and/or

reliability equal to the equipment listed above

3. Equipment Prohibited for Use

Caution for Export

Please do not incorporate our products into the following

equipment requiring extremely high levels of safety and/or

reliability.

Some of our products listed in this catalog may require specific

procedures for export according to“U.S. Export Administration

Regulations”,“Foreign Exchange and Foreign Trade Control Law”

of Japan, and other applicable regulations. Should you have any

questions on this matter, please contact our sales staff.

(1) Aerospace equipment (artiﬁcial satellite, rocket, etc.)

(2) Aviation equipment *¹

(3) Medical devices classiﬁed as GHTF Class D (Japan Class IV),

implantable medical devices *²

▶This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our product speciﬁcation sheets.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .

for General Electronic Equipment

MULTILAYER CERAMIC CAPACITORS

WAVE REFLOW

■PARTS NUMBER

△＝Blank space

△

⑤

－

⑩

△

⑫

①

②

③

④

⑥

⑦

⑧

⑨

⑪

①Rated voltage

③End termination

Code

Rated voltage［VDC］

Code

End termination

Plated

2.5

Cu Internal Electrodes (For High Frequency)

6.3

④Dimension（L×W）

Type

Dimensions

EIA（inch）

（L×W）［mm］

021

042

063

0.25× 0.125

0.4 × 0.2

008004

01005

0201

0402

0204

0603

0306

0805

0508

1206

1210

1812

0.6 × 0.3

100

250

630

2000

1.0 × 0.5

105

107

212

0.52× 1.0 ※

1.6 × 0.8

0.8 × 1.6 ※

2.0 × 1.25

1.25× 2.0 ※

3.2 × 1.6

②Series name

Code

Series name

316

325

432

Multilayer ceramic capacitor

3.2 × 2.5

Multilayer ceramic capacitor for high frequency

LW reverse type multilayer capacitor

4.5 × 3.2

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code

△

Type

ALL

063

105

107

L［mm］

W［mm］

T［mm］

Standard

0.6±0.05

1.0±0.10

0.3±0.05

0.5±0.10

1.6＋0.15/－0.05

0.8＋0.15/－0.05

0.45±0.05

212

2.0＋0.15/－0.05

1.25＋0.15/－0.05

1.6±0.20

0.85±0.10

1.25＋0.15/－0.05

0.85±0.10

316

3.2±0.20

1.6±0.20

325

063

105

3.2±0.30

2.5±0.30

0.6±0.09

0.3±0.09

1.0＋0.15/－0.05

0.5＋0.15/－0.05

0.45±0.05

107

1.6＋0.20/－0

0.8＋0.20/－0

0.45±0.05

212

2.0＋0.20/－0

1.25＋0.20/－0

0.85±0.10

1.25＋0.20/－0

1.6±0.30

316

105

063

105

3.2±0.30

1.6±0.30

1.0＋0.20/－0

0.6 + 0.25/- 0

1.0＋0.30/－0

0.5＋0.20/－0

0.3 + 0.25/- 0

0.5＋0.30/－0

0.5＋0.20/－0

0.3 + 0.25/ - 0

0.5＋0.30/－0

Note: cf. STANDARD EXTERNAL DIMENSIONS

△= Blank space

⑥Temperature characteristics code

■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor）

Applicable

standard

Temperature

range［℃］

Capacitance

tolerance

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

±10％

±20％

±10％

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

±10％

code

JIS

－25～＋ 85

－55～＋ 85

－55～＋125

－55～＋105

－55～＋125

－55～＋ 85

EIA

X5R

X7R

X6S

X7S

X5R

±15％

±22％

LD(※)

±15％

±20％

Note : ※.LD Low distortion high value multilayer ceramic capacitor

△= Blank space

▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspeciﬁcationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspeciﬁcationꢀsheets.ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■Temperature compensating type

Applicable

Temperature

range［℃］

Capacitance

tolerance

±0.05pF

±0.1pF

±0.25pF

±0.5pF

±5％

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

standard

code

EIA

C0G

－55～＋125

0±30ppm/℃

±0.25pF

±0.5pF

±5％

JIS

－55～＋125

－750±120ppm/℃

－750±250ppm/℃

EIA

JIS

EIA

U2J

－55～＋125

±0.25pF

U2K

⑥Series code

⑨Thickness

・Super low distortion multilayer ceramic capacitor

Code

Thickness［mm］

Code

Series code

Standard

0.125

0.13

0.18

・Medium-High Voltage Multilayer Ceramic Capacitor

0.2

Code

Series code

Standard

0.3

0.45（107type or more）

0.5

⑦Nominal capacitance

Code

Nominal capacitance

（example）

0R5

0.5pF

1pF

0.8

010

0.85（212type or more）

100

10pF

1.15

1.25

1.6

101

100pF

1,000pF

10,000pF

102

103

1.9

104

0.1

1.0

2.0 max

2.5

105

106

107

100

μF

⑩Special code

Note : R＝Decimal point

Code

－

Special code

Standard

⑧Capacitance tolerance

Code

Capacitance tolerance

±0.05pF

±0.1pF

⑪Packaging

Code

Packaging

φ178mm Taping （2mm pitch）

φ178mm Taping （4mm pitch）

±0.25pF

±0.5pF

φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

±1pF

±2％

φ178mm Taping （2mm pitch）105type only

（Thickness code E,H）

±5％

±10％

φ178mm Taping（1mm pitch）021/042type only

±20％

＋80/－20％

⑫Internal code

Code

△

Internal code

Standard

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■STANDARD EXTERNAL DIMENSIONS

Dimension [mm]

Type( EIA )

□MK021（008004）

0.25±0.013

0.125±0.013

0.0675±0.0275

□VS021（008004）

□MK042（01005）

□VS042（01005）

0.4±0.02

0.6±0.03

0.2±0.02

0.3±0.03

0.2±0.02

0.3±0.03

0.1±0.03

0.15±0.05

□MK063（0201）

0.13±0.02

0.18±0.02

0.2±0.02

□MK105（0402）

1.0±0.05

0.5±0.05

0.25±0.10

0.3±0.03

0.5±0.05

□VK105（0402）

1.0±0.05

0.5±0.05

1.0±0.05

0.5±0.05

0.25±0.10

0.18±0.08

□WK105（0204）※

0.52±0.05

0.3±0.05

0.45±0.05

0.8±0.10

□MK107（0603）

1.6±0.10

0.8±0.10

1.6±0.10

0.35±0.25

0.25±0.15

□WK107（0306）※

0.5±0.05

0.45±0.05

0.85±0.10

1.25±0.10

0.85±0.10

1.15±0.10

1.6±0.20

□MK212（0805）

□WK212（0508）※

□MK316（1206）

2.0±0.10

1.25±0.15

3.2±0.15

1.25±0.10

2.0±0.15

1.6±0.15

0.5±0.25

0.3±0.2

※ LW reverse type

0.5＋0.35/－0.25

0.85±0.10

1.15±0.10

1.9±0.20

□MK325（1210）

□MK432（1812）

3.2±0.30

4.5±0.40

2.5±0.20

3.2±0.30

0.6±0.3

1.9＋0.1/－0.2

2.5±0.20

2.0+0/-0.30

2.5±0.20

0.6±0.4

0.9±0.6

Note : ※. LW reverse type, *1.Thickness code

■STANDARD QUANTITY

Dimension

Standard quantity［pcs］

Type

021

EIA（inch）

［mm］

0.125

Code

Paper tape

－

Embossed tape

50000

008004

01005

042

0.2

0.3

－

40000

－

063

105

0201

15000

0.13

0.18

0.2

－

20000

15000

－

20000

15000

0402

0.3

－

0.5

10000

－

0204 ※

0603

0.30

0.45

0.8

4000

－

4000

－

107

212

316

0306 ※

0.50

0.45

0.85

1.25

0.85

1.15

1.6

4000

0805

－

4000

－

3000

－

0508 ※

1206

－

3000

2000

－

0.85

1.15

1.9

－

2000

325

432

1210

1812

2.0 max

2.5

－

1000

500

2.0 max

2.5

Note : ※.LW Reverse type（□WK）

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■PARTS NUMBER

Medium-High Voltage Multilayer Ceramic Capacitors

●105TYPE

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.5mm thickness（V）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK105 B7221[]V-F

HMK105 B7331[]V-F

HMK105 B7471[]V-F

HMK105 B7681[]V-F

HMK105 B7102[]V-F

HMK105 B7152[]V-F

HMK105 B7222[]V-F

HMK105 B7332[]V-F

HMK105 B7472[]V-F

X7R

220 p

330 p

±10, ±20

2.5

200

0.5±0.05

470 p

680 p

100

1000 p

1500 p

2200 p

3300 p

4700 p

【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】ꢀ0.5mm thickness（V）

(at 1MHz)

min

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Thickness^*3[mm]

Part number 1

Part number 2

Capacitance tolerance

Rated voltage x ％

HMK105 CG080DV-F

HMK105 CG090DV-F

HMK105 CG100DV-F

HMK105 CG120JV-F

HMK105 CG150JV-F

HMK105 CG180JV-F

HMK105 CG220JV-F

HMK105 CG240JV-F

HMK105 CG270JV-F

HMK105 CG330JV-F

HMK105 CG390JV-F

HMK105 CG470JV-F

HMK105 CG560JV-F

HMK105 CG680JV-F

HMK105 CG820JV-F

HMK105 CG101JV-F

C0G

8 p

9 p

±0.5pF

±5％

560

200

0.5±0.05

580

10 p

12 p

15 p

18 p

22 p

24 p

27 p

33 p

39 p

47 p

56 p

68 p

82 p

100 p

600

640

700

760

840

880

100

940

1000

●107TYPE

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK107 BJ102[]A-T

HMK107 BJ152[]A-T

HMK107 BJ222[]A-T

HMK107 BJ332[]A-T

HMK107 BJ472[]A-T

HMK107 BJ682[]A-T

HMK107 BJ103[]A-T

HMK107 BJ153[]A-T

HMK107 BJ223[]A-T

HMK107 BJ333[]A-T

HMK107 BJ473[]A-T

HMK107 BJ104[]A-T

HMK107 BJ224[]A-TE

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

±10, ±20

3.5

200

150

0.8±0.10

X5R^*1

100

X5R^*1

0.22 μ

【Temperature Characteristic C7 : X7S（－55～＋125℃）】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

0.8±0.10

Part number 1

Part number 2

Rated voltage x ％

150

HMK107 C7224[]A-TE

100

X7S

0.22 μ

±10, ±20

3.5

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK107 B7102[]A-T

HMK107 B7152[]A-T

HMK107 B7222[]A-T

HMK107 B7332[]A-T

HMK107 B7472[]A-T

HMK107 B7682[]A-T

HMK107 B7103[]A-T

HMK107 B7153[]A-T

HMK107 B7223[]A-T

HMK107 B7333[]A-T

HMK107 B7473[]A-T

HMK107 B7104[]A-T

X7R

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.1 μ

±10, ±20

3.5

200

0.8±0.10

100

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■PARTS NUMBER

【Temperature Characteristic SD : Standard（－55～＋125℃）】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK107 SD101KA-T

HMK107 SD121KA-T

HMK107 SD151KA-T

HMK107 SD181KA-T

HMK107 SD221KA-T

HMK107 SD271KA-T

HMK107 SD331KA-T

HMK107 SD391KA-T

HMK107 SD471KA-T

HMK107 SD561KA-T

HMK107 SD681KA-T

HMK107 SD821KA-T

HMK107 SD102KA-T

100 p

120 p

150 p

180 p

220 p

270 p

330 p

390 p

470 p

560 p

680 p

820 p

1000 p

±10

0.1

200

0.8±0.10

100

Standard Type

●212TYPE

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK212 BJ103[]G-T

HMK212 BJ153[]G-T

HMK212 BJ223[]G-T

HMK212 BJ333[]G-T

HMK212 BJ473[]G-T

HMK212 BJ683[]G-T

HMK212 BJ104[]G-T

HMK212 BJ224[]G-T

HMK212 BJ474[]G-TE

HMK212BBJ105[]G-TE

QMK212 BJ472[]G-T

QMK212 BJ682[]G-T

QMK212 BJ103[]G-T

QMK212 BJ153[]G-T

QMK212 BJ223[]G-T

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

1.25±0.10

1.25+0.20/-0

1.25±0.10

X5R^*1

100

X5R^*1

0.22 μ

0.47 μ

1 μ

X5R^*1

4700 p

X5R^*1

6800 p

X5R^*1

250

0.01 μ

0.015 μ

0.022 μ

X5R^*1

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

QMK212 BJ102[]D-T

QMK212 BJ152[]D-T

QMK212 BJ222[]D-T

QMK212 BJ332[]D-T

1000 p

1500 p

2200 p

3300 p

±10, ±20

2.5

150

0.85±0.10

X5R^*1

250

X5R^*1

【Temperature Characteristic C7 : X7S（－55～＋125℃）】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK212 C7474[]G-TE

HMK212BC7105[]G-TE

100

X7S

0.47 μ

1 μ

±10, ±20

3.5

150

1.25±0.10

1.25+0.20/-0

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK212 B7103[]G-T

HMK212 B7153[]G-T

HMK212 B7223[]G-T

HMK212 B7333[]G-T

HMK212 B7473[]G-T

HMK212 B7683[]G-T

HMK212 B7104[]G-T

HMK212 B7224[]G-T

QMK212 B7472[]G-T

QMK212 B7682[]G-T

QMK212 B7103[]G-T

QMK212 B7153[]G-T

QMK212 B7223[]G-T

X7R

0.01 μ

0.015 μ

0.022 μ

0.033 μ

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

1.25±0.10

100

250

0.22 μ

4700 p

6800 p

0.01 μ

0.015 μ

0.022 μ

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

QMK212 B7102[]D-T

QMK212 B7152[]D-T

QMK212 B7222[]D-T

QMK212 B7332[]D-T

X7R

1000 p

1500 p

2200 p

3300 p

±10, ±20

2.5

150

0.85±0.10

250

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■PARTS NUMBER

【Temperature Characteristic SD : Standard（－55～＋125℃）】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK212 SD222KD-T

HMK212 SD472KD-T

QMK212 SD101KD-T

QMK212 SD121KD-T

QMK212 SD151KD-T

QMK212 SD181KD-T

QMK212 SD221KD-T

QMK212 SD331KD-T

QMK212 SD391KD-T

QMK212 SD471KD-T

QMK212 SD561KD-T

QMK212 SD681KD-T

QMK212 SD821KD-T

QMK212 SD102KD-T

2200 p

4700 p

100 p

120 p

150 p

180 p

220 p

330 p

390 p

470 p

560 p

680 p

820 p

1000 p

±10

0.1

200

150

0.85±0.10

100

Standard Type

250

【Temperature Characteristic SD : Standard（－55～＋125℃）】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

1.25±0.10

Part number 1

Part number 2

Rated voltage x ％

200

Standard Type

HMK212 SD392KG-T

100

3900 p

±10

0.1

●316TYPE

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK316 BJ473[]L-T

HMK316 BJ683[]L-T

HMK316 BJ104[]L-T

HMK316 BJ154[]L-T

HMK316 BJ224[]L-T

HMK316 BJ334[]L-T

HMK316 BJ474[]L-T

HMK316 BJ105[]L-T

HMK316ABJ225[]L-TE

QMK316 BJ333[]L-T

QMK316 BJ473[]L-T

QMK316 BJ683[]L-T

QMK316 BJ104[]L-T

SMK316 BJ153[]L-T

SMK316 BJ223[]L-T

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

120

1.6±0.20

X5R^*1

0.15 μ

0.22 μ

0.33 μ

0.47 μ

1 μ

X5R^*1

100

X5R^*1

2.2 μ

X5R^*1

0.033 μ

0.047 μ

0.068 μ

0.1 μ

X5R^*1

250

630

X5R^*1

0.015 μ

0.022 μ

X5R^*1

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ1.15mm thickness（F）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

SMK316 BJ102[]F-T

SMK316 BJ152[]F-T

SMK316 BJ222[]F-T

SMK316 BJ332[]F-T

SMK316 BJ472[]F-T

SMK316 BJ682[]F-T

SMK316 BJ103[]F-T

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

±10, ±20

2.5

120

1.15±0.10

X5R^*1

630

X5R^*1

【Temperature Characteristic C7 : X7S（－55～＋125℃）】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

1.6±0.20

Part number 1

Part number 2

Rated voltage x ％

150

HMK316AC7225[]L-TE

100

X7S

2.2 μ

±10, ±20

3.5

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK316 B7473[]L-T

HMK316 B7683[]L-T

HMK316 B7104[]L-T

HMK316 B7154[]L-T

HMK316 B7224[]L-T

HMK316 B7334[]L-T

HMK316 B7474[]L-T

HMK316 B7105[]L-T

QMK316 B7333[]L-T

QMK316 B7473[]L-T

QMK316 B7683[]L-T

QMK316 B7104[]L-T

SMK316 B7153[]L-T

SMK316 B7223[]L-T

SMK316AB7333[]L-T

SMK316AB7473[]L-T

X7R

0.047 μ

0.068 μ

0.1 μ

±10, ±20

3.5

2.5

200

150

120

1.6±0.20

0.15 μ

0.22 μ

0.33 μ

0.47 μ

1 μ

100

0.033 μ

0.047 μ

0.068 μ

0.1 μ

250

630

0.015 μ

0.022 μ

0.033 μ

0.047 μ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■PARTS NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.15mm thickness（F）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

SMK316 B7102[]F-T

SMK316 B7152[]F-T

SMK316 B7222[]F-T

SMK316 B7332[]F-T

SMK316 B7472[]F-T

SMK316 B7682[]F-T

SMK316 B7103[]F-T

X7R

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

0.01 μ

±10, ±20

2.5

120

1.15±0.10

630

【Temperature Characteristic SD : Standard（－55～＋125℃）】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK316 SD223KL-T

QMK316 SD103KL-T

100

250

0.022 μ

0.01 μ

±10

0.1

200

150

1.6±0.20

Standard Type

●325TYPE

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK325 BJ225[]M-P

HMK325 BJ475[]M-PE

100

2.2 μ

4.7 μ

±10, ±20

3.5

200

150

2.5±0.20

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ1.9mm thickness（N）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK325 BJ154[]N-T

HMK325 BJ224[]N-T

HMK325 BJ334[]N-T

HMK325 BJ474[]N-T

HMK325 BJ684[]N-T

HMK325 BJ105[]N-T

HMK325 BJ475[]N-TE

QMK325 BJ473[]N-T

QMK325 BJ104[]N-T

QMK325 BJ154[]N-T

QMK325 BJ224[]N-T

SMK325 BJ223[]N-T

SMK325 BJ333[]N-T

SMK325 BJ473[]N-T

0.15 μ

0.22 μ

0.33 μ

0.47 μ

0.68 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

1.9±0.20

X5R^*1

100

X5R^*1

4.7 μ

X5R^*1

0.047 μ

0.1 μ

X5R^*1

250

630

X5R^*1

0.15 μ

0.22 μ

0.022 μ

0.033 μ

0.047 μ

X5R^*1

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】ꢀ1.15mm thickness（F）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

1.15±0.10

Part number 1

Part number 2

Rated voltage x ％

200

X5R^*1

HMK325 BJ104[]F-T

100

0.1 μ

±10, ±20

3.5

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

2.5±0.20

Part number 1

Part number 2

Rated voltage x ％

200

HMK325 B7225[]M-P

100

X7R

2.2 μ

±10, ±20

3.5

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.9mm thickness（N）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK325 B7154[]N-T

HMK325 B7224[]N-T

HMK325 B7334[]N-T

HMK325 B7474[]N-T

HMK325 B7684[]N-T

HMK325 B7105[]N-T

QMK325 B7473[]N-T

QMK325 B7104[]N-T

QMK325 B7154[]N-T

QMK325 B7224[]N-T

SMK325 B7223[]N-T

SMK325 B7333[]N-T

SMK325 B7473[]N-T

X7R

0.15 μ

0.22 μ

0.33 μ

0.47 μ

0.68 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

1.9±0.20

100

0.047 μ

0.1 μ

250

630

0.15 μ

0.22 μ

0.022 μ

0.033 μ

0.047 μ

【Temperature Characteristic C7 : X7S（－55～＋125℃）】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

2.5±0.20

Part number 1

Part number 2

Rated voltage x ％

150

HMK325 C7475[]M-PE

100

X7S

4.7 μ

±10, ±20

3.5

【Temperature Characteristic C7 : X7S（－55～＋125℃）】ꢀ1.9mm thickness（N）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

1.9±0.20

Part number 1

Part number 2

Rated voltage x ％

150

HMK325 C7475[]N-TE

100

X7S

4.7 μ

±10, ±20

3.5

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

for General Electronic Equipment

■PARTS NUMBER

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ1.15mm thickness（F）

Soldering

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

1.15±0.10

Part number 1

Part number 2

R:Reflow

W:Wave

Rated voltage x ％

200

HMK325 B7104[]F-T

100

X7R

0.1 μ

±10, ±20

3.5

●432TYPE

【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】 2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

X5R^*1

HMK432 BJ474[]M-T

HMK432 BJ105[]M-T

HMK432 BJ155[]M-T

HMK432 BJ225[]M-T

QMK432 BJ104[]M-T

QMK432 BJ224[]M-T

QMK432 BJ334[]M-T

QMK432 BJ474[]M-T

SMK432 BJ473[]M-T

SMK432 BJ683[]M-T

SMK432 BJ104[]M-T

0.47 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

2.5±0.20

X5R^*1

100

X5R^*1

1.5 μ

X5R^*1

2.2 μ

X5R^*1

0.1 μ

X5R^*1

0.22 μ

0.33 μ

0.47 μ

0.047 μ

0.068 μ

0.1 μ

250

630

X5R^*1

【Temperature Characteristic B7 : X7R（－55～＋125℃）】 2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

HMK432 B7474[]M-T

HMK432 B7105[]M-T

HMK432 B7155[]M-T

HMK432 B7225[]M-T

QMK432 B7104[]M-T

QMK432 B7224[]M-T

QMK432 B7334[]M-T

QMK432 B7474[]M-T

SMK432 B7473[]M-T

SMK432 B7683[]M-T

SMK432 B7104[]M-T

X7R

0.47 μ

1 μ

±10, ±20

3.5

2.5

200

150

120

2.5±0.20

100

1.5 μ

2.2 μ

0.1 μ

0.22 μ

0.33 μ

0.47 μ

0.047 μ

0.068 μ

0.1 μ

250

630

【Temperature Characteristic B7 : X7R（－55～＋125℃）】ꢀ2.0mm thickness（Y）

Soldering

R:Reflow

W:Wave

HTLT

Rated voltage

[V]

Temperature

characteristics

Capacitance

[F]

Capacitance tolerance

[％]

tanδ

[％]

Thickness^*3[mm]

Part number 1

Part number 2

Rated voltage x ％

XMK432 B7222KY-TE

XMK432 B7472KY-TE

2000

X7R

2200 p

4700 p

±10

2.5

110

2.0+0/-0.30

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

Multilayer Ceramic Capacitors

■PACKAGING

①Minimum Quantity

●Taped package

Thickness

Standard quantity [pcs]

Type(EIA)

code

Paper tape

Embossed tape

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

□MK063(0201)

0.125

－

50000

0.2

C, D

P,T

40000

0.3

15000

10000

－

□WK105(0204) ※

0.3

0.13

0.18

0.2

20000

15000

－

□MK105(0402)

□MF105(0402)

20000

15000

10000

4000

－

0.3

－

0.5

－

□VK105(0402)

□MK107(0603)

□WK107(0306) ※

□MF107(0603)

□VS107(0603)

□MJ107(0603)

0.5

－

0.45

0.5

－

4000

－

0.8

4000

3000

0.7

－

0.8

3000

0.45

0.85

1.25

0.85

1.25

0.85

1.15

1.6

□MK212(0805)

4000

－

□WK212(0508)

□MF212(0805)

※

－

4000

－

3000

－

□VS212(0805)

□MJ212(0805)

－

2000

－

4000

－

□MK316(1206)

□MF316(1206)

3000

2000

3000

2000

－

1.15

1.6

－

□MJ316(1206)

－

0.85

1.15

1.9

－

2000

□MK325(1210)

□MF325(1210)

2.0max.

2.5

－

1000

2000

1.9

□MJ325(1210)

□MK432(1812)

2.5

500(T), 1000(P)

500

2.5

Note : ※ LW Reverse type.

②Taping material

※No bottom tape for pressed carrier tape

●Card board carrier tape

●Embossed tape

Top tape

Base tape

Sprocket hole

Chip cavity

Sprocket hole

Chip cavity

Bottom tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip filled

Chip

※ LW Reverse type.

③Representative taping dimensions

●Paper Tape（8mm wide）

●Pressed carrier tape（ 2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

Ｔ

□MK063(0201)

0.37

0.67

0.45max.

0.42max.

□WK105(0204) ※

□MK105(0402) （*1 C）

□MK105(0402) （*1 P）

2.0±0.05

0.65

1.15

0.4max.

0.3max.

0.42max.

Unit：mm

0.45max.

Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.

●Punched carrier tape （2mm pitch）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

2.0±0.05

4.0±0.1

(0.079±0.002) (0.157±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK105 (0402)

□MF105 (0402)

□VK105 (0402)

0.65

1.15

2.0±0.05

0.8max.

Unit：mm

●Punched carrier tape （4mm pitch）

φ1.5＋0.1/－0

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK107(0603)

□WK107(0306)

□MF107(0603)

□MK212(0805)

□WK212(0508)

□MK316(1206)

※

1.0

1.8

1.1max.

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.

Unit：mm

●Embossed tape（4mm wide）

Sprocket hole

Unit：mm（inch）

0.9±0.05

φ0.8±0.04

(0.035±0.002)

(φ0.031±0.002)

1.0±0.02

2.0±0.04

(0.039±0.001) (0.079±0.002)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK021(008004)

□VS021(008004)

□MK042(01005)

□VS042(01005)

0.135

0.27

1.0±0.02

0.5max.

0.25max.

Unit：mm

0.23

0.43

●Embossed tape（8mm wide）

Unit：mm（inch）

1.75±0.1

φ1.5＋0.1/－0

(0.069±0.004）

(φ0.059＋0.004/-0)

Sprocket hole

4.0±0.1

(0.157±0.004)

2.0±0.1

(0.079±0.004)

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK105(0402)

0.6

1.0

1.1

1.8

2.0±0.1

0.6max

1.3max.

0.2±0.1

0.25±0.1

□WK107(0306) ※

□MK212(0805)

1.65

2.0

2.4

3.6

□MF212(0805)

4.0±0.1

□MK316(1206)

□MF316(1206)

3.4max.

0.6max.

□MK325(1210)

2.8

□MF325(1210)

Note： ※ LW Reverse type.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

●Embossed tape（12mm wide）

φ1.5＋0.1/－0

(φ0.059＋0.004/-0)

Unit：mm（inch）

1.75±0.1

(0.069±0.004）

Sprocket hole

4.0±0.1

2.0±0.1

(0.157±0.004)

(0.079±0.004)

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□MK325(1210)

□MK432(1812)

3.1

3.7

4.0

4.9

8.0±0.1

4.0max.

0.6max.

Unit：mm

④Trailer and Leader

Blank portion

Chip cavity

Blank portion

Leader

100mm or more

160mm or more

(3.94inches or more)

(6.3inches or more)

400mm or more

(15.7inches or more)

Direction of tape feed

⑤Reel size

φ13.0±0.2

φ178±2.0

φ50min.

φ21.0±0.8

2.0±0.5

1.0

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

Unit：mm

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.

Pull direction

0～20°

Top tape

Base tape

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E06R01

Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Medium-High Voltage Multilayer Ceramic Capacitor

■RELIABILITY DATA

1. Operating Temperature Range

Temperature Compensating（Class1）

: －55 to ＋125℃

X7R, X7S : －55 to ＋125℃

Specified Value

X5R

: －55 to ＋85℃

: －25 to ＋85℃

: －55 to ＋125℃

High Permittivity （Class2）

2. Storage Temperature Range

Temperature Compensating（Class1）

: －55 to ＋125℃

X7R, X7S : －55 to ＋125℃

Specified Value

X5R

: －55 to ＋85℃

: －25 to ＋85℃

: －55 to ＋125℃

High Permittivity （Class2）

3. Rated Voltage

Specified Value

Temperature Compensating（Class1）

High Permittivity （Class2）

100VDC(HMK)

100VDC(HMK), 250VDC(QMK), 630VDC(SMK), 2000VDC(XMK)

4. Withstanding Voltage（Between terminals）

Specified Value

No breakdown or damage

Applied voltage

Duration

: Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）(XMK)

Test Methods and

Remarks

: 1 to 5sec.

: 50mA max.

Charge/discharge current

5. Insulation Resistance

Specified Value

Temperature Compensating（Class1）

10000 MΩ min.

High Permittivity （Class2）

100MΩ・μF or 10GΩ, whichever is smaller.

Applied voltage

Duration

: Rated voltage（HMK, QMK）, 500V（SMK,XMK）

Test Methods and

Remarks

: 60±5sec.

: 50mA max.

Charge/discharge current

6. Capacitance （Tolerance）

0.2pF≦C≦5pF

0.2pF≦C≦10pF

C＞10pF

： ±0.25pF

Temperature Compensating（Class1）

： ±0.5pF

Specified Value

： ±5% or ±10%

High Permittivity （Class2）

±10%, ±20%

Measuring frequency

Measuring voltage

Bias application

: 1MHz±10%

: 0.5～5Vrms

: None

Temperature Compensating（Class1）

High Permittivity （Class2）

Test Methods and

Remarks

Measuring frequency

Measuring voltage

Bias application

: 1kHz±10%

: 1±0.2Vrms

: None

7. Q or Dissipation Factor

C＜30pF : Q≧400＋20C

C≧30pF : Q≧1000

Temperature Compensating（Class1）

（C：Nominal capacitance）

Specified Value

High Permittivity （Class2）

3.5%max（HMK）,2.5%max（QMK, SMK）

Measuring frequency

Measuring voltage

Bias application

: 1MHz±10%

Temperature Compensating（Class1）

: 0.5～5Vrms

: None

Test Methods and

Remarks

Measuring frequency

Measuring voltage

Bias application

: 1kHz±10%

: 1±0.2Vrms

: None

High Permittivity （Class2）

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_mhv_reli_e-E09R01

8. Temperature Characteristic of Capacitance

Temperature Compensating（Class1）

：0±30ppm/℃(－55 to ＋125℃)

: ±10%（－25 to ＋85℃）

: ±15%（－55 to ＋85℃）

: ±15%（－55 to ＋125℃

: ±22%（－55 to ＋125℃）

X5R

X7R

X7S

Specified Value

High Permittivity （Class2）

Class 1

（－55 to ＋125℃）

Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

（C₈₅－C₂₀）

×10⁶（ppm/℃）

C₂₀×△T

△T＝65

Class 2

Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

Test Methods and

Remarks

Step

X5R、X7R、X6S、X7S

Minimum operating temperature

20℃

25℃

Maximum operating temperature

（C－C₂）

C₂

×100（%）

: Capacitance value in Step 1 or Step 3

C2 : Capacitance value in Step 2

9. Deflection

Appearance

: No abnormality

Temperature Compensating（Class1）

High Permittivity （Class2）

Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.

Specified Value

Appearance

: No abnormality

: Within±10%

Capacitance change

Warp

: 1mm

Duration

Test board

Thickness

: 10sec.

: Glass epoxy-resin substrate

: 1.6mm

Test Methods and

Remarks

Capacitance measurement shall be conducted with the board bent.

10. Adhesive Strength of Terminal Electrodes

Temperature Compensating（Class1）

High Permittivity （Class2）

Specified Value

No terminal separation or its indication.

Test Methods and Applied force

: 5N

Remarks

Duration

: 30±5sec.

11. Solderability

Specified Value

Temperature Compensating（Class1）

High Permittivity （Class2）

At least 95% of terminal electrode is covered by new solder

Eutectic solder

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Solder type

H60A or H63A

230±5℃

Test Methods and

Remarks

Solder temperature

Duration

4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_mhv_reli_e-E09R01

12. Resistance to Soldering

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.(HMK)

: Initial value

Temperature Compensating（Class1）

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Specified Value

Appearance

: No abnormality

Capacitance change

Dissipation facto

Insulation resistance

Withstanding voltage

: Within±15%（HMK）, ±10%（QMK, SMK,XMK）

: Initial value

High Permittivity （Class2）

: Initial value

（between terminals） : No abnormality

Temperature Compensating（Class1）

Preconditioning

Solder temperature

Duration

None

270±5℃

3±0.5sec.

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5min.

24±2hrs under the standard condition Note3

Preheating conditions

Recovery

Test Methods and

Remarks

High Permittivity （Class2）

Thermal treatment（at 150℃ for 1hr） Note1

270±5℃

Preconditioning

Solder temperature

Duration

3±0.5sec.

80 to 100℃, 2 to 5 min.

Preheating conditions

Recovery

150 to 200℃, 2 to 5min.

24±2hrs under the standard condition Note3

13. Temperature Cycle （Thermal Shock）

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.(HMK)

: Initial value

Temperature Compensating（Class1）

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Specified Value

Appearance

: No abnormality

Capacitance change

Dissipation facto

Insulation resistance

Withstanding voltage

: Within±15%（HMK）, ±10%（QMK, SMK ,XMK）

: Initial value

High Permittivity （Class2）

: Initial value

（between terminals） : No abnormality

Class 1

None

Class 2

Preconditioning

1 cycle

Thermal treatment （at 150℃ for 1 hr） Note 1

Step

Temperature（℃）

Time（min.）

30±3

Minimum operating temperature

Normal temperature

Test Methods and

Remarks

2 to 3

Maximum operating temperature

Normal temperature

30±3

2 to 3

Number of cycles

Recovery

5 times

6 to 24 hrs （Standard condition） Note 3

24±2 hrs （Standard condition） Note 3

14. Humidity （Steady state）

Appearance

: No abnormality

Capacitance change

: Within ±5% or ±0.5pF, whichever is larger.(HMK)

: C＜10pF : Q≧200＋10C

Temperature Compensating（Class1）

10≦C＜30pF : Q≧275＋2.5C

C≧30pF:Q≧350（C：Nominal capacitance）

: 1000 MΩ min.

Specified Value

Insulation resistance

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK）, 5%max（QMK, SMK, XMK）.

: 25MΩμF or 1000MΩ, whichever is smaller.

High Permittivity （Class2）

Class 1

None

Class 2

Thermal treatment（ at 150℃ for 1 hr） Note 1

40±2℃

Preconditioning

Temperature

Humidity

40±2℃

Test Methods and

Remarks

90 to 95%RH

500＋24/－0 hrs

90 to 95%RH

Duration

500＋24/－0 hrs

Recovery

6 to 24 hrs （Standard condition） Note 3

24±2 hrs （Standard condition） Note 3

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_mhv_reli_e-E09R01

15. Humidity Loading

Specified Value

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger (HMK).

: C＜30pF：Q≧100＋10C/3

Temperature Compensating（Class1）

High Permittivity （Class2）

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩ min.

Insulation resistance

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

: 7%max（HMK）, 5%max（QMK, SMK, XMK）.

: 10MΩμF or 500MΩ, whichever is smaller.

According to JIS 5101-1.

Preconditioning

Class 1

Class 2

Voltage treatment

None

（Rated voltage are applied for 1 hour at 40℃） Note 2

Temperature

Humidity

40±2℃

Test Methods and

Remarks

90 to 95%RH

Duration

500＋24/－0 hrs

Rated voltage

500＋24/－0 hrs

Rated voltage

Applied voltage

Charge/discharge

current

50mA max.

Recovery

6 to 24 hrs （Standard condition） Note 3

24±2 hrs（Standard condition） Note 3

16. High Temperature Loading

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger.(HMK)

: C＜30pF：Q≧100＋10C/3

Temperature Compensating（Class1）

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩ min.

Insulation resistance

Specified Value

Appearance

: No abnormality

Capacitance change

Dissipation factor

Insulation resistance

: Within±15%

High Permittivity （Class2）

: 7%max（HMK）, 5%max（QMK, SMK, XMK）.

: 50MΩμF or 1000MΩ, whichever is smaller.

According to JIS 5101-1.

Class 1

None

Class 2

Voltage treatment Note 2

Preconditioning

Temperature

Duration

Maximum operating temperature

1000＋48/－0 hrs

Maximum operating temperature

1000＋48/－0 hrs

Test Methods and

Remarks

Rated voltage×2(HMK), Rated voltage×1.5（QMK）,

Rated voltage×1.2（SMK,XMK）

Applied voltage

Rated voltage×2(HMK)

50mA max.

Charge/discharge

current

50mA max.

Recovery

6 to 24hr （Standard condition） Note 3

24±2 hrs （Standard condition） Note 3

Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at

for 24±2hours.

room temperature

Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the

test conditions, and kept at room temperature for 24±2hours.

Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa

When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under

the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa

Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_mhv_reli_e-E09R01

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

Precautions

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

Land patterns for PCBs

Land pattern

（unit: mm）

Solder-resist

Wave-soldering

Chip capacitor

Type

107

1.6

212

2.0

316

3.2

325

3.2

Size

0.8

1.25

1.6

2.5

0.8 to 1.0

0.5 to 0.8

0.6 to 0.8

1.0 to 1.4

0.8 to 1.5

0.9 to 1.2

1.8 to 2.5

0.8 to 1.7

1.2 to 1.6

1.8 to 2.5

0.8 to 1.7

1.8 to 2.5

Chip capacitor

Technical

Reflow-soldering

Type 021

considerations

042

0.4

0.2

063

0.6

0.3

105

1.0

0.5

107

1.6

212

2.0

316

3.2

325

3.2

432

4.5

3.2

0.25

Size

0.125

0.8

1.25

1.6

2.5

0.095～0.135 0.15～0.25 0.20～0.30 0.45～0.55

0.085～0.125 0.10～0.20 0.20～0.30 0.40～0.50

0.110～0.150 0.15～0.30 0.25～0.40 0.45～0.55

0.6～0.8

0.8～1.2

0.9～1.6

1.8～2.5

1.0～1.5

1.2～2.0

1.8～2.5

1.0～1.5

1.8～3.2

2.5～3.5

1.5～1.8

2.3～3.5

Note：Recommended land size might be different according to the allowance of the size of the product.

LWDC

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type

105

0.52

107

0.8

212

1.25

Size

1.0

1.6

2.0

0.18～0.22

0.2～0.25

0.9～1.1

0.25～0.3

0.3～0.4

1.5～1.7

0.5～0.7

0.4～0.5

1.9～2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E08R01

（2）Examples of good and bad solder application

Item

Not recommended

Recommended

Solder-resist

Lead wire of component

Mixed mounting of SMD and

leaded components

Chassis

Solder-resist

Solder (for grounding)

Component placement close to

the chassis

Electrode pattern

Lead wire of component

Soldering iron

Solder-resist

Hand-soldering of leaded

components near mounted

components

Solder-resist

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any

stresses from board warp or deflection.

possible mechanical

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

Perforation

Slit

Magnitude of stress A＞B＝C＞D＞E

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E08R01

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

Item

Improper method

Proper method

chipping

or cracking

Single-sided mounting

supporting pins

or back-up pins

Double-sided mounting

chipping

or cracking

supporting pins

or back-up pins

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

Technical

considerations

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Amount adhesive

After capacitor are bonded

Figure

212/316 case sizes as examples

0.3mm min

100 to 120μm

Adhesives shall not contact land

4. Soldering

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

Technical

considerations

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E08R01

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

［Reflow soldering］

【Recommended conditions for eutectic

【Recommended condition for Pb-free

soldering】

300

Peak

260℃ Max.

Within 10sec.

Preheating

230℃

Within 10sec.

60sec. 60sec

Min.

200

100

200

Slow

Slow cooling

cooling

100

Heating above

230℃

Preheating150℃

60sec. Min.

40sec. Max.

1/2T～1/3T

Capacitor

PC board

Caution

Solder

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible. soldering for 2 times.

［Wave soldering］

【Recommended conditions for eutectic

【Recommended condition for Pb-free

soldering】

300

soldering】

300

Peak

230～250℃

Within 3sec.

260℃ Max.

Within 10sec.

Preheating

120sec. Min.

200

100

Slow

Slow cooling

Preheating

150℃

cooling

100

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.

［Hand soldering］

【Recommended conditions for eutectic

【Recommended condition for Pb-free

soldering】

400

soldering】

400

300

200

100

Peak

280℃ Max.

Within 3sec.

230～280℃

Within 3sec.

350℃ Max.

Within 3sec.

300

⊿T

Slow cooling

200

Slow cooling

⊿T

200

Slow cooling

Preheating

150℃ Min.

Preheating

150℃ Min.

100

Preheating

60sec. Min.

⊿T

316type or less

⊿T≦150℃

325type or more

⊿T≦130℃

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors. soldering for 1 times.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E08R01

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of

capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully

checked;

Technical

considerations

Ultrasonic output :

20 W/ℓ or les

Ultrasonic frequency :

40 kHz or less

Ultrasonic washing period : 5 min. or less

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while

left under normal storage conditions resulting in the deterioration of the capacitor's performance.

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

Precautions

The use of such resins, molding materials etc. is not recommended.

7. Handling

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

◆Mechanical considerations

Precautions

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.

8. Storage conditions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity : Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to

design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for

1hour.

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

Technical

considerations

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E08R01

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